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作者:Conroy, Gemma
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作者:Docter-Loeb, Hannah; Dodd, Paul
作者单位:Norwegian Polar Institute
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作者:Jing, Jixiang; Sun, Fuqiang; Wang, Zhongqiang; Ma, Linjie; Luo, Yumeng; Du, Zhiyuan; Zhang, Tianyu; Wang, Yicheng; Xu, Feng; Zhang, Tongtong; Chen, Changsheng; Ma, Xuhang; He, Yang; Zhu, Ye; Sun, Huarui; Wang, Xinqiang; Zhou, Yan; Tsoi, James Kit Hon; Wrachtrup, Joerg; Wong, Ngai; Li, Can; Ki, Dong-Keun; Wang, Qi; Li, Kwai Hei; Lin, Yuan; Chu, Zhiqin
作者单位:University of Hong Kong; Peking University; University of Hong Kong; Southern University of Science & Technology; University of Hong Kong; University of Hong Kong; Hong Kong Polytechnic University; Southern University of Science & Technology; Harbin Institute of Technology; Harbin Institute of Technology; Peking University; Peking University; The Chinese University of Hong Kong, Shenzhen; University of Hong Kong; University of Stuttgart; Max Planck Society; University of Hong Kong
摘要:Diamond is an exceptional material with great potential across various fields owing to its interesting properties1,2. However, despite extensive efforts over the past decades3, 4-5, producing large quantities of desired ultrathin diamond membranes for widespread use remains challenging. Here we demonstrate that edge-exposed exfoliation using sticky tape is a simple, scalable and reliable method for producing ultrathin and transferable polycrystalline diamond membranes. Our approach enables the...
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作者:Kim, Ki Seok; Seo, Seunghwan; Kwon, Junyoung; Lee, Doyoon; Kim, Changhyun; Ryu, Jung-El; Kim, Jekyung; Suh, Jun Min; Jung, Hang-Gyo; Jo, Youhwan; Shin, June-Chul; Song, Min-Kyu; Feng, Jin; Ahn, Hogeun; Lee, Sangho; Cho, Kyeongjae; Jeon, Jongwook; Seol, Minsu; Park, Jin-Hong; Kim, Sang Won; Kim, Jeehwan
作者单位:Massachusetts Institute of Technology (MIT); Massachusetts Institute of Technology (MIT); Samsung; Samsung; Massachusetts Institute of Technology (MIT); Sungkyunkwan University (SKKU); University of Texas System; University of Texas Dallas; Sungkyunkwan University (SKKU)
摘要:The demand for the three-dimensional (3D) integration of electronic components is steadily increasing. Despite substantial processing challenges, the through-silicon-via (TSV) technique emerges as the only viable method for integrating single-crystalline device components in a 3D format1,2. Although monolithic 3D (M3D) integration schemes show promise3, the seamless connection of single-crystalline semiconductors without intervening wafers has yet to be demonstrated. This challenge arises from...
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作者:[Anonymous]
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作者:Booth, Garrett S.; Jacobs, Jeremy W.; Adkins, Brian D.; Raza, Sheharyar
作者单位:Vanderbilt University; University of Texas System; University of Texas Southwestern Medical Center; University of Toronto
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作者:[Anonymous]
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作者:[Anonymous]
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作者:Chauvin, Roselyne J.; Dosenbach, Nico U. F.
作者单位:Washington University (WUSTL); Washington University (WUSTL)
摘要:Brain-wide association studies, which aim to link features of the brain to a person's characteristics, have a replicability problem. Besides increasing sample size, what else can be done to make these studies more reproducible? Sampling schemes for reproducible brain-wide association studies.
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作者:Kudiabor, Helena