Super-nano domains enable strength-conductivity synergy in copper foils

• 成果类型: Article
• 署名作者: Cheng, Zhao; Liu, Linhai; Yu, Zhiyang; Ye, Xiaoyuan; Tao, Nairong; Zhu, Ting; Lu, Lei
• 署名单位: Chinese Academy of Sciences; Institute of Metal Research, CAS; Chinese Academy of Sciences; University of Science & Technology of China, CAS; Fuzhou University; University System of Georgia; Georgia Institute of Technology
• 刊物名称: SCIENCE
• ISSN/ISSBN: 0036-8075; 1095-9203
• DOI: 10.1126/science.aed7758
• 发表日期: 2026-04-16
• 页码: 275-279
• 关键词: mechanical-properties; GROWTH; microstructure; dislocations; deformation; plasticity; ductility; TENSILE; MODEL; films

摘要

The development of copper foils that simultaneously exhibit ultrahigh strength, high electrical conductivity, and thermal stability remains a major challenge for advanced electronics and energy storage systems. We report a 10-micrometer-thick copper foil featuring nanoscale grains and periodically distributed gradient super-nano domains (approximately 3 nanometers in size) throughout its thickness that was produced by an industrially scalable electrodeposition process. This copper foil demonstrates a combination of approximately 900-megapascal tensile strength, 90% standard electrical conductivity, and exceptional thermal stability. These superior properties originate from a dual strengthening-stabilization mechanism in which the periodically distributed super-nano domains both enhance strength and stabilize grain boundaries. This strategy not only advances copper foil technology but also provides a general design pathway for developing other scalable, high-performance metallic materials.