Setup time reduction for electronics assembly: Combining simple (SMED) and IT-based methods

• 成果类型: Article
• 署名作者: Trovinger, SC; Bohn, RE
• 署名单位: University of California System; University of California San Diego
• 刊物名称: PRODUCTION AND OPERATIONS MANAGEMENT
• ISSN/ISSBN: 1059-1478
• 发表日期: 2005
• 页码: 205-217
• 关键词: setup reduction; printed circuit board assembly; SMED; flexibility; process improvement

摘要

As much as 50% of effective capacity can be lost to setups in printed circuit board assembly. Shigeo Shingo showed that radical reductions in setup times are possible in metal fabrication using an approach he called Single Minute Exchange of Dies (SMED). We applied SMED to setups of high speed circuit board assembly tools. Its key concepts were valid in this very different industry, but while SMED typically emphasizes process simplification, we had to add modern information technology tools including wireless terminals, barcodes, and a relational database. These tools shield operators from the inherent complexity of managing thousands of unique parts and feeders. The economic value of setup reduction is rarely calculated. We estimate a reduction of key setup times by more than 80%, and direct benefits of $1.8 million per year. Total cost of the changes was approximately $350,000.