A 2D route to 3D computer chips
成果类型：
Editorial Material
署名作者：
Roy, Tania
署名单位：
Duke University
刊物名称：
Nature
ISSN/ISSBN：
0028-5096
DOI：
10.1038/d41586-023-03992-6
发表日期：
2024-01-11
页码：
249-250
关键词：
摘要：
Ultrathin materials have long been touted as a solution to the problems faced by the ever-growing semiconductor industry. Evidence that 3D chips can be built from 2D semiconductors suggests that the hype was justified.