Axon-like active signal transmission

• 成果类型: Article
• 署名作者: Brown, Timothy D.; Zhang, Alan; Nitta, Frederick U.; Grant, Elliot D.; Chong, Jenny L.; Zhu, Jacklyn; Radhakrishnan, Sritharini; Islam, Mahnaz; Fuller, Elliot J.; Talin, A. Alec; Shamberger, Patrick J.; Pop, Eric; Williams, R. Stanley; Kumar, Suhas
• 署名单位: United States Department of Energy (DOE); Sandia National Laboratories; Stanford University; Texas A&M University System; Texas A&M University College Station
• 刊物名称: Nature
• ISSN/ISSBN: 0028-5557
• DOI: 10.1038/s41586-024-07921-z
• 发表日期: 2024-09-26
• 页码: 804-+
• 关键词: chaos; edge

摘要

Any electrical signal propagating in a metallic conductor loses amplitude due to the natural resistance of the metal. Compensating for such losses presently requires repeatedly breaking the conductor and interposing amplifiers that consume and regenerate the signal. This century-old primitive severely constrains the design and performance of modern interconnect-dense chips(1). Here we present a fundamentally different primitive based on semi-stable edge of chaos (EOC)(2,3), a long-theorized but experimentally elusive regime that underlies active (self-amplifying) transmission in biological axons(4,5). By electrically accessing the spin crossover in LaCoO3, we isolate semi-stable EOC, characterized by small-signal negative resistance and amplification of perturbations(6,7). In a metallic line atop a medium biased at EOC, a signal input at one end exits the other end amplified, without passing through a separate amplifying component. While superficially resembling superconductivity, active transmission offers controllably amplified time-varying small-signal propagation at normal temperature and pressure, but requires an electrically energized EOC medium. Operando thermal mapping reveals the mechanism of amplification-bias energy of the EOC medium, instead of fully dissipating as heat, is partly used to amplify signals in the metallic line, thereby enabling spatially continuous active transmission, which could transform the design and performance of complex electronic chips.